Solutions
Line Card
We represent manufacturers whose technologies sit on the critical path of high-density data center deployment. Our primary focus is two-phase, direct-to-chip liquid cooling — built for the rack densities AI and HPC workloads now demand. Each partner is selected for technical relevance, production readiness, and fit with the engineering teams shaping today's greenfield and high-density projects.
Technology Focus
Active Coverage — Two-Phase, Direct-to-Chip Liquid Cooling
The thermal envelope of next-generation GPU deployments has outgrown what air and single-phase loops can serve. Two-phase, direct-to-chip is the cooling architecture purpose-built for that ceiling — covering the full thermal path from the processor through the coolant distribution unit out to the facility's heat rejection infrastructure.
- Density
- 150–250 kW per rack, with deployments pushing toward 288 kW in 48U. Sized for current and next-generation GPU stacks.
- Coverage
- Chip to chiller — full thermal-path coverage from direct-to-chip cooling at the processor, through the CDU, out to facility heat rejection.
- Leak Profile
- Dielectric refrigerant — leak-safe by chemistry. A leak does not damage hardware.
- Serviceability
- ~90% of critical components hot-swappable, with N+1 pump redundancy and auto-failover. Built for uptime in 24/7 environments.
Represented Manufacturers
Manufacturer 01 — logo pending
Manufacturer 02 — logo pending
Manufacturer partner announcements forthcoming.
Expanding Coverage
Additional categories are being added to the line card, including single-phase direct-to-chip liquid cooling and complementary critical infrastructure components.
- Single-phase direct-to-chip liquid cooling
Why Two-Phase, Why Now
Data center infrastructure is built in layers — compute, cooling, power, and deployment. As rack densities move past 100 kW and continue climbing, cooling architecture becomes a much earlier and more consequential design decision. Two-phase direct-to-chip is the clearest example of that shift.
Density
GPU racks now run at 150–250 kW, with deployments pushing toward 288 kW in 48U. Air cooling and legacy thermal assumptions are reaching their limits.
Efficiency
Two-phase systems reduce facility cooling burden by operating with warmer water and a more efficient thermal path, improving long-term site performance.
Reliability
Refrigerant-based dielectric cooling changes the risk profile of liquid cooling, reducing the consequences of a leak while supporting dense, serviceable deployments.
Two-phase direct-to-chip is early in its adoption curve. The engineering teams evaluating it now are making decisions that will define their sites' density ceiling for the next decade.
On a project? Let's align.
If you're specifying cooling on a high-density build, we can help frame the architecture and bring the right manufacturer resources into the conversation.